HEAVY CUTTING ABILITY
Q²M Compound+ was designed to offer you the ability to more easily address deep, scratches in less passes with your machine. Q2M Compound+ can be used with a rotary, random orbital, or dual action machine. Look to couple Q2M Compound+ with a wool cutting pad on a rotary machine, or a microfiber cutting disc on a random orbital or dual action machine.
A high level of cutting power comes with an impressively low dust level and high quality finish. The Q²M Compound+ formula is water-based and contains high quality Japanese abrasives, allowing great results in just one cutting paste. No silicone or fillers make the procedure of pre-coating preparation and polish removal much easier and quicker.
ADVICE ON APPLICATION AND PRECAUTIONS
Work with a polishing machine of your choice (rotary, dual-action or orbital with forced rotation). Spread at low revs. Work until fully diminished at medium revs. Wipe off with an high quality microfiber cloth. Use Q2M Prep to remove the remaining product and inspect the result. If needed, re-use until the desired result is reached.